IPC 7531 PDF

Rather than working from footprint dimensions, the IPC Compliant Footprint Wizard uses dimensional information from the component itself in accordance with the standards released by the IPC. Based on the formulas developed for the IPC standard, the Wizard then generates the footprint using standard Altium Designer objects, such as pads and tracks. PcbLib document. Altium Designer must be restarted to complete installation. Click on the component type desired. The preview region on the right-hand side of the Wizard dynamically changes to show the currently selected component and also states the type of packages that are allowed to be generated.

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Rather than working from footprint dimensions, the IPC Compliant Footprint Wizard uses dimensional information from the component itself in accordance with the standards released by the IPC. Based on the formulas developed for the IPC standard, the Wizard then generates the footprint using standard Altium Designer objects, such as pads and tracks.

PcbLib document. Altium Designer must be restarted to complete installation. Click on the component type desired. The preview region on the right-hand side of the Wizard dynamically changes to show the currently selected component and also states the type of packages that are allowed to be generated. The following table lists the component types and packages that are supported in the Wizard. Find your component type in the following list then click on the link to access the information regarding that component type.

Use the BGA Package Layout Options page to define the basic ball layout by adding or removing balls and changing the grid type. Select the grid type from the drop-down. Selections include Plain Grid or Staggered Grid. Select the matrix type from the drop-down. The pad diameter is determined using the following methods:. The BGA Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined.

You can further define the silkscreen dimensions by entering a new value for the Silkscreen Line Width. Enable the Use calculated silkscreen dimensions to use the displayed values or disable the checkbox and enter the desired new values in the textboxes. Enable the Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing.

For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox.

You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layer and selecting the desired mechanical layer. A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. You can also select the mechanical layer for the component body by using the drop-down next to Layer and selecting the desired mechanical layer.

Use the diagram to the right as a guide for each measurement. The Preview region is dynamically updated to show the Pin location. The minimum heel spacing is calculated by subtracting twice the Maximum Lead Length Range from the Minimum Body Width that were set on the previous page. The maximum heel spacing is calculated by adding the tolerance on the inner distance between the heels of the opposing rows of leads to the minimum heel spacing.

Enable the Use calculated values checkbox to use the values currently displayed or enter values directly in the textboxes for S Minimum and S Maximum. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs. Use the Board density Level drop-down to select the desired board density. Enter the new values directly in the textboxes. Component manufacturers usually specify the minimum and maximum value for each package dimension.

Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges based upon experience. IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. Enable Use Default Values to accept the displayed values.

You can change the values for Fabrication Tolerance Assumption , Placement Tolerance Assumption , and Courtyard Excess by entering the new values directly in the textboxes. The BQFP Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. Select the correct Pad Shape , either Rounded or Rectangular.

The BQFP Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter new desired values. Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. Enable Use calculated values to use the values displayed or disable the option and enter new desired values.

You can adjust three of these ranges. The CFP Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined.

Select either Rounded or Rectangular for the Pad Shape. The CFP Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values. Enter the required values for the package pin dimensions on the ChipArray Package Pin Dimensions page.

Set the required solder fillet values on the ChipArray Solder Fillets page. The ChipArray Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. The ChipArray Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined.

Use the Board Density Level drop-down to select the desired board density. Enter the Periphery value in the textbox. The DFN Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined.

The DFN Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. Enter the required values for the package dimensions on the Chip Component Package Dimensions page. Select the Polarity Pin Location. Choices include: None , Pin 1 , and Pin 2. Enable the Use calculated values checkbox to use the values currently displayed or enter new values directly in the textboxes for S Minimum and S Maximum.

Set the required solder fillet values on the Chip Component Solder Fillets page. Enter the required values for component tolerances on the Chip Component Component Tolerances page. The Chip Component Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. The Chip Component Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined.

The CQFP Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. Select either Rounded or Rectangular for Pad Shape. Enable the Pin is trimmed checkbox to denote trimmed pins for each pad designator in the table. The DPAK Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined.

The DPAK Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. Enable Use calculated values to accept the displayed values or disable the checkbox and enter the desired values. Enter the required values for component tolerances on the Leadless Chip Carrier Component Tolerances page.

The Leadless Chip Carrier Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. Use the LGA Package Layout Options page to define the basic ball layout by adding or removing balls and changing the grid type. Enable Use default values to accept the displayed Periphery value or disable and enter new values. The LGA Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined.

The MELF Component Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. The MELF Component Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined.

Enter the required values for component tolerances on the Molded Component Component Tolerances page. The Molded Component Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined.

The Molded Component Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. Enter any required changes in the textboxes. The PQFN Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined.

The PQFN Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. The PQFP Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. The PQFP Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. The PSON Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined.

To use the displayed values, enable Use calculated footprint values or disable and enter new values for Paste Fill Dimensions. The PSON Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. The QFN Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined.

The QFN Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. Enable Calculate number of pins in rows to use the displayed values or disable and enter new Number of pins values.

Enable the Use calculated values checkbox to use the values currently displayed or enter new values directly in the textboxes for S1 Minimum and S1 Maximum. The SOIC Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. The SOIC Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined.

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Email: sales jjsmanufacturing. Much has been written about the increasing shortages of multi-layer ceramic capacitors MLCC , surface mount SMT resistors and other semiconductor devices. Right now we are seeing price increases and greatly extended lead times. Where components can be found, it is quite possible that they will be offered in smaller package sizes than before. We might find, for example, the popular nF capacitor soon only being available in or packages.

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